SNLS779A July 2025 – November 2025 DP83TC815-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | UNIT | ||
|---|---|---|---|
| RHA (VQFN) | |||
| 36 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 30.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 21.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 13.1 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 11.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.8 | °C/W |