SNLS779A July 2025 – November 2025 DP83TC815-Q1
PRODUCTION DATA
| PIN | STATE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME(2) | NO. | ||
| MAC INTERFACE | |||
| RX_CLK | 27 | S, PD, O |
Receive Clock: In MII and RGMII modes, the receive clock provides a 25MHz reference clock. Unused in RMII and SGMII modes |
|
RX_D0 |
26 | S, PD, O |
Receive Data: Symbols received on the cable are decoded and transmitted out of these pins synchronous to the rising edge of RX_CLK. They contain valid data when RX_DV is asserted. A data nibble, RX_D[3:0], is transmitted in MII and RGMII modes. 2 bits; RX_D[1:0], are transmitted in RMII mode. If the PHY is bootstrapped to RMII Leader mode, a 50MHz clock reference is automatically outputted on RX_D3. This clock must be fed to the MAC. RX_M / RX_P: Differential SGMII Data Output. These pins transmit data from the PHY to the MAC. |
| RX_D1 | 25 | ||
| RX_D2 / RX_P | 24 | ||
| RX_D3 / RX_M | 23 | ||
| RX_DV / CRS_DV / RX_CTRL | 15 | S, PD, O |
Receive Data Valid: This pin indicates when valid data is presented on RX_D[3:0] for MII mode. Carrier Sense Data Valid: This pin combines carrier sense and data valid into an asynchronous signal. When CRS_DV is asserted, data is presented on RX_D[1:0] in RMII mode. RGMII Receive Control: Receive control combines receive data valid indication and receive error indication into a single signal. RX_DV is presented on the rising edge of RX_CLK and RX_ER is presented on the falling edge of RX_CLK. Unused in SGMII mode |
| RX_ER / GPIO_6 | 14 | S, PD, O |
Receive Error: In MII and RMII modes, this pin indicates a receive error symbol has been detected within a received packet. In MII mode, RX_ER is asserted high synchronously to the rising edge of RX_CLK. In RMII mode, RX_ER is asserted high synchronously to the rising edge of the reference clock. This pin is optional in MII or RMII because the PHY automatically corrupts data on a receive error. Unused in RGMII and SGMII modes This pin can be used as GPIO_6. |
| TX_CLK | 28 | PD, I, O |
Transmit Clock: In MII mode, the transmit clock is a 25MHz output (50 ohm Driver). In RGMII mode, this clock is sourced from the MAC layer to the PHY. A 25MHz clock must be provided in RGMII mode to meet the RGMII timing requirements mentioned in Timing Requirements. Unused in RMII and SGMII modes |
| TX_D0 / TX_M | 33 | PD, I |
Transmit Data: In MII and RGMII modes, the transmit data nibble, TX_D[3:0], is received from the MAC prior to the rising edge of TX_CLK. In RMII mode, TX_D[1:0] is received from the MAC prior to the rising edge of the reference clock. TX_D[3:2] are not used in RMII mode. TX_M / TX_P: Differential SGMII Data Input. These pins receive data that is transmitted from the MAC to the PHY. |
| TX_D1 / TX_P | 32 | ||
| TX_D2 | 31 | ||
| TX_D3 | 33 | ||
| TX_EN / TX_CTRL | 29 | PD, I |
Transmit Enable: In MII mode, transmit enable is presented prior to the rising edge of the transmit clock. TX_EN indicates the presence of valid data inputs on TX_D[3:0]. In RMII Leader mode, transmit enable is presented prior to the rising edge of RX_D3. TX_EN indicates the presence of valid data inputs on TX_D[1:0]. RGMII Transmit Control: Transmit control combines transmit enable and transmit error indication into a single signal. TX_EN is presented prior to the rising edge of TX_CLK; TX_ER is presented prior to the falling edge of TX_CLK. Unused in SGMII mode |
| SERIAL MANAGEMENT INTERFACE | |||
| MDC | 1 | I |
Management Data Clock: Synchronous clock to the MDIO serial management input and output data. This clock can be asynchronous to the MAC transmit and receive clocks. The maximum clock rate is 20MHz. There is no minimum clock rate. |
| MDIO | 36 | OD, IO |
Management Data Input/Output: Bidirectional management data signal that can be sourced by the management station or the PHY. This pin requires a pullup resistor. In systems with multiple PHYs using same MDIO-MDC bus, a single pull-up resistor must be used on MDIO line. Recommended to use a resistor between 2.2kΩ and 9kΩ. MDIO/MDC Access is required to pass Open Alliance Compliance. See Section 7.3.8. |
| CONTROL INTERFACE | |||
| INH | 10 |
O, OD |
INH: Active-HIGH output. This pin is Hi-Z when the PHY is in TC-10 SLEEP. This pin is HIGH for all other PHY states. External pull down resistor in the range of 2k? - 10k? must be used when implementing TC-10 circuit. If multiple devices are sharing INH pin, then a single pull down resistor must be used. |
| INT | 2 | PU, OD, IO |
Interrupt: Active-LOW output, asserts LOW when an interrupt condition occurs. This pin has a weak internal pullup. Register access is necessary to enable various interrupt triggers. Once an interrupt event flag is set, register access is required to clear the interrupt event. This pin can be configured as an Active-HIGH output using register 0x0011. Interrupt status from Reg 12-13 is recommended to be read only when INT_N is LOW. This pin can also operate as Power-Down control where asserting this pin low would put the PHY in power down mode and asserting high would put the PHY in normal mode. This feature can also be enabled through register 0x0011. |
| RESET | 3 | PU, I |
Reset: Active-LOW input, which initializes or reinitializes the PHY. Asserting this pin LOW for at least 1μs forces a reset process to occur. All internal registers reinitialize to the default states as specified for each bit in the Register Maps section. All bootstrap pins are resampled upon deassertion of reset. |
| WAKE | 8 |
PD, I/O |
WAKE: Input/Output pin which is Active-HIGH input by default. As input, this pin wakes the PHY from TC-10 SLEEP. Asserting this pin HIGH at power-up brings the PHY out of SLEEP. External 10k? pull down resistor can be used when implementing TC-10 circuit to prevent accidental wake-up. This pin can be directly tied to VSLEEP or it can be pulled to VSLEEP through a resistor to wake the device. This pin also supports wake forwarding feature where a WAKE pulse generated by the PHY is then used to wake up other PHYs in the same system. |
| CLOCK INTERFACE | |||
| XI | 5 | I |
Reference Clock Input (RMII): Reference clock 25MHz crystal or oscillator in RMII Leader mode. Reference Clock Input (Other MAC Interfaces): Reference clock 25MHz crystal or oscillator input. The device supports either an external crystal resonator connected across pins XI and XO, or an external CMOS-level oscillator connected to pin XI only and XO left floating. This pin can also accept clock input from other devices like Ethernet MAC or another Ethernet PHY in daisy-chain operations. If using a crystal, connect a 100? resistor in series with the XI pin |
| XO | 4 | O |
Reference Clock Output: XO pin is used for crystal only. This pin must be left floating when a CMOS-level oscillator is connected to XI. |
| LED/GPIO INTERFACE | |||
| CLKOUT / GPIO_2 | 16 | IO |
Clock Output: 25MHz reference clock. This pin can also be used as LED or GPIO via Strap/Register selection. Program register<0x045F>=0x000F and register<0x0453>=0x0003 to disable switching on clkout pin |
| GPIO_3(3) | 18 | PD, IO | General Purpose IO pins |
| GPIO_4 | 19 | S, PD, IO | |
| GPIO_5 | 20 | PD, IO | |
| LED_0 / GPIO_0 | 35 | S, PD, IO |
LED_0: Link Status LED. This pin can also be used as LED or clock output through Register selection. |
| LED_1 / GPIO_1 | 6 | S, PD, IO |
LED_1: Link Status and BLINK for TX/RX Activity. This pin can also be used as LED or clock output via Strap/Register selection. |
| MEDIUM DEPENDENT INTERFACE | |||
| TRD_M | 13 | IO |
Differential Transmit and Receive: Bidirectional differential signaling configured for 100BASE-T1 operation, IEEE 802.3bw compliant. |
| TRD_P | 12 | ||
| POWER CONNECTIONS | |||
| GND | GND | GROUND |
Ground: This must always be connected to power ground. |
| LDO_OUT | 9 | SUPPLY |
1.0V LDO Out: 1.0V Internal LDO Regulator Output 1.0V is generated internally from 3.3V VDDA Core supply. Connect to VDD1P0 (Pin 21) for Single Supply Mode. Leave floating for Dual Supply Mode |
| VDD1P0 | 21 | SUPPLY |
VDD1P0 Supply: 1.0V Connect to LDO_OUT (Pin 9) for Single Supply Mode. Connect to external regulator for Dual Supply Mode. In Dual Supply Mode, recommend using ferrite bead and 2.2μF and 0.1μF ceramic decoupling capacitors. |
| VDDA | 11 | SUPPLY |
Core Supply: 3.3V Recommend using 0.47μF and 0.01μF ceramic decoupling capacitors; optional ferrite bead can be used. |
| VDDIO | 34 | SUPPLY |
IO Supply: 1.8V, 2.5V, or 3.3V Recommend using ferrite bead, 0.47μF and 0.01μF ceramic decoupling capacitors. |
| VDDMAC | 22 | SUPPLY |
Optional MAC Interface Supply: 1.8V, 2.5V, or 3.3V Optional separate supply for MAC interface pins. This pin supplies power to the MAC interface pins and can be kept at a different voltage level as compared to other IO pins. Recommend using 0.47μF, and 0.01μF ceramic decoupling capacitors and ferrite bead. When separate VDDMAC is not required in the system then it must be connected to VDDIO. When connecting to VDDIO, 0.47μF on the VDDIO can be removed. 0.47μF must still be connected close to VDDMAC. In this case, one common ferrite bead can be used between VDDIO and VDDMAC. |
| VSLEEP | 7 | SUPPLY |
VSLEEP Supply: 3.3V Recommend using 0.1μF ceramic decoupling capacitors. |
| DO NOT CONNECT | |||
| DNC | 17 | – |
DNC: Do not connect (leave floating) |