ZHCSH28C September 2017 – May 2025 TPA3221
PRODUCTION DATA
| THERMAL METRIC(1) | TPA3221 | UNIT | ||
|---|---|---|---|---|
| DDV 44-PINS HTSSOP | ||||
| JEDEC STANDARD 4 LAYER PCB | FIXED 85°C HEATSINK TEMPERATURE(2) | |||
| RθJA | Junction-to-ambient thermal resistance | 44.8 | 5.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 1.1 | 2.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 14.9 | n/a | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.6 | n/a | °C/W |
| ψJB | Junction-to-board characterization parameter | 14.7 | n/a | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | °C/W |