ZHCSV76A June 2022 – March 2024 TMS570LC4357-SEP
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| °C / W | ||
|---|---|---|
| RΘJA | Junction-to-free air thermal resistance, still air (includes 5×5 thermal via cluster in 2s2p PCB connected to 1st ground plane) | 14.3 |
| RΘJB | Junction-to-board thermal resistance (includes 5×5 thermal via cluster in 2s2p PCB connected to 1st ground plane) | 5.49 |
| RΘJC | Junction-to-case thermal resistance (2s0p PCB) | 5.02 |
| ΨJT | Junction-to-package top, still air (includes 5×5 thermal via cluster in 2s2p PCB connected to 1st ground plane) | 0.29 |
| ΨJB | Junction-to-board, still air (includes 5×5 thermal via cluster in 2s2p PCB connected to 1st ground plane) | 6.41 |