ZHCSCK8H May 2014 – April 2025 LP8860-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LP8860 | UNIT | |
|---|---|---|---|
| HLQFP PowerPAD (VLP) | |||
| 32 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(2) | 36.0 | °C/W |
| RθJCtop | Junction-to-case (top) thermal resistance | 23.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 15.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 15.5 | °C/W |
| RθJCbot | Junction-to-case (bottom) thermal resistance | 1.6 | °C/W |