ZHCSCK8H May 2014 – April 2025 LP8860-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- Device Comparison Table
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Thermal Information
- 5.5 Electrical Characteristics
- 5.6 Current Sinks Electrical Characteristics
- 5.7 Boost Converter Characteristics
- 5.8 Logic Interface Characteristics
- 5.9 VIN Undervoltage Protection (VIN_UVLO)
- 5.10 VDD Undervoltage Protection (VDD_UVLO)
- 5.11 VIN Overvoltage Protection (VIN_OVP)
- 5.12 VIN Overcurrent Protection (VIN_OCP)
- 5.13 Power-Line FET Control Electrical Characteristics
- 5.14 External Temp Sensor Control Electrical Characteristics
- 5.15 I2C Serial Bus Timing Parameters (SDA, SCLK)
- 5.16 SPI Timing Requirements
- 5.17 Typical Characteristics
-
6 Detailed Description
- 6.1 Overview
- 6.2 Functional Block Diagram
- 6.3 Feature Description
- 6.4 Device Functional Modes
- 6.5 Programming
- 6.6
Register Maps
- 6.6.1
Register Bit Explanations
- 6.6.1.1 Display/Cluster1 Brightness Control MSB
- 6.6.1.2 Display/Cluster1 Brightness Control LSB
- 6.6.1.3 Display/Cluster1 Output Current MSB
- 6.6.1.4 Display/Cluster1 Output Current LSB
- 6.6.1.5 Cluster2 Brightness Control MSB
- 6.6.1.6 Cluster2 Brightness Control LSB
- 6.6.1.7 Cluster2 Output Current
- 6.6.1.8 Cluster3 Brightness Control MSB
- 6.6.1.9 Cluster3 Brightness Control LSB
- 6.6.1.10 Cluster3 Output Current
- 6.6.1.11 Cluster4 Brightness Control MSB
- 6.6.1.12 Cluster4 Brightness Control LSB
- 6.6.1.13 Cluster4 Output Current
- 6.6.1.14 Configuration
- 6.6.1.15 Status
- 6.6.1.16 Fault
- 6.6.1.17 LED Fault
- 6.6.1.18 Fault Clear
- 6.6.1.19 Identification
- 6.6.1.20 Temp MSB
- 6.6.1.21 Temp LSB
- 6.6.1.22 Display LED Current MSB
- 6.6.1.23 Display LED Current LSB
- 6.6.1.24 Display LED PWM MSB
- 6.6.1.25 Display LED PWM LSB
- 6.6.1.26 EEPROM Control
- 6.6.1.27 EEPROM Unlock Code
- 6.6.2
EEPROM Bit Explanations
- 6.6.2.1 EEPROM Register 0
- 6.6.2.2 EEPROM Register 1
- 6.6.2.3 EEPROM Register 2
- 6.6.2.4 EEPROM Register 3
- 6.6.2.5 EEPROM Register 4
- 6.6.2.6 EEPROM Register 5
- 6.6.2.7 EEPROM Register 6
- 6.6.2.8 EEPROM Register 7
- 6.6.2.9 EEPROM Register 8
- 6.6.2.10 EEPROM Register 9
- 6.6.2.11 EEPROM Register 10
- 6.6.2.12 EEPROM Register 11
- 6.6.2.13 EEPROM Register 12
- 6.6.2.14 EEPROM Register 13
- 6.6.2.15 EEPROM Register 14
- 6.6.2.16 EEPROM Register 15
- 6.6.2.17 EEPROM Register 16
- 6.6.2.18 EEPROM Register 17
- 6.6.2.19 EEPROM Register 18
- 6.6.2.20 EEPROM Register 19
- 6.6.2.21 EEPROM Register 20
- 6.6.2.22 EEPROM Register 21
- 6.6.2.23 EEPROM Register 22
- 6.6.2.24 EEPROM Register 23
- 6.6.2.25 EEPROM Register 24
- 6.6.1
Register Bit Explanations
-
7 Application and Implementation
- 7.1 Application Information
- 7.2
Typical Applications
- 7.2.1
Typical Application for Display Backlight
- 7.2.1.1 Design Requirements
- 7.2.1.2
Detailed Design Procedure
- 7.2.1.2.1 Inductor Selection
- 7.2.1.2.2 Output Capacitor Selection
- 7.2.1.2.3 Input Capacitor Selection
- 7.2.1.2.4 Charge Pump Output Capacitor
- 7.2.1.2.5 Charge Pump Flying Capacitor
- 7.2.1.2.6 Diode
- 7.2.1.2.7 Boost Converter Transistor
- 7.2.1.2.8 Boost Sense Resistor
- 7.2.1.2.9 Power Line Transistor
- 7.2.1.2.10 Input Current Sense Resistor
- 7.2.1.2.11 Filter Component Values
- 7.2.1.3 Application Performance Plots
- 7.2.2 Low VDD Voltage and Combined Output Mode Application
- 7.2.3 High Output Voltage Application
- 7.2.4 High Output Current Application
- 7.2.5 Three-Channel Configuration Without Serial Interface
- 7.2.6 Solution With Minimum External Components
- 7.2.1
Typical Application for Display Backlight
- 7.3 Power Supply Recommendations
- 7.4 Layout
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- VFP|32
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- VFP|32
訂購(gòu)信息
7.2.1.2.1 Inductor Selection
There are two main considerations when choosing an inductor; the inductor must not saturate, and the inductor current ripple must be small enough to achieve the desired output voltage ripple. Different saturation current rating specifications are followed by different manufacturers so attention must be given to details. Saturation current ratings are typically specified at 25°C. However, ratings at the maximum ambient temperature of application should be requested from the manufacturer. Shielded inductors radiate less noise and are preferable. The saturation current must be greater than the sum of the maximum load current and the worst case average-to-peak inductor current. The equation below shows the worst case conditions.
- IRIPPLE: peak inductor current
- IOUTMAX: maximum load current
- VIN: minimum input voltage in application
- L: min inductor value including worst case tolerances
- f: minimum switching frequency
- VOUT: output voltage
- D: Duty Cycle for CCM Operation
- VOUT: Output Voltage
As a result the inductor must be selected according to the ISAT. A more conservative and recommended approach is to choose an inductor that has a saturation current rating greater than the maximum switch current limit defined by <BOOST_IMAX_SEL[2:1]> EEPROM bits. A 22-μH to 33-μH inductor with a saturation current rating of at least 9 A is recommended for most applications. The inductor resistance must be less than 300 mΩ for good efficiency. See detailed information in Texas Instruments Application Note Understanding Boost Power Stages in Switch Mode Power Supplies (SLVA061). “Power Stage Designer? Tools” can be used for the boost calculation: http://www.ti.com/tool/powerstage-designer.