SLVAEU0A September   2020  – November 2025 LM117HVQML-SP , LM117QML-SP , LM136A-2.5QML-SP , LM137JAN-SP , LM137QML-SP , LM185-1.2QML-SP , LM185-2.5QML-SP , LM2940QML-SP , LM2941QML-SP , LM4050QML-SP , LM723JAN-SP , LP2953QML-SP , TL1431-SP , TPS50601-SP , TPS50601A-SP , TPS7A4501-SP , TPS7H1101-SP , TPS7H1101A-SP , TPS7H1111-SP , TPS7H1121-SP , TPS7H2201-SP , TPS7H2211-SP , TPS7H3301-SP , TPS7H4001-SP , TPS7H4002-SP , TPS7H4011-SP , TPS7H5001-SP , TPS7H5002-SP , TPS7H5003-SP , TPS7H5004-SP , TPS7H6003-SP , TPS7H6013-SP , TPS7H6023-SP , UC1525B-SP , UC1611-SP , UC1705-SP , UC1707-SP , UC1708-SP , UC1709-SP , UC1710-SP , UC1715-SP , UC1823A-SP , UC1825-SP , UC1825A-SP , UC1825B-SP , UC1832-SP , UC1834-SP , UC1842-SP , UC1842A-SP , UC1843-SP , UC1843A-SP , UC1843B-SP , UC1844-SP , UC1844A-SP , UC1845-SP , UC1845A-SP , UC1846-SP , UC1856-SP , UC1863-SP , UC1875-SP , UC1901-SP , UC19432-SP , UCC1806-SP

1.   1
2.   Abstract
3.   Trademarks
4. 1Reflow Profiles
5. 2Critical Considerations for Gold-Plated Termination-Finishes
6. 3Considerations for Leadless Ceramic Chip Carrier Packages
7. 4Lead Forming
8. 5Ceramic Packaging
9. 6References
10. 7Revision History

Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and Form