3 Considerations for Leadless Ceramic Chip Carrier Packages

The critical items for board-level solder process for a Leadless Ceramic Chip Carrier (LCCC) package are solder paste thickness and depth of package insertion into the paste during pick and place.

• If the paste under the package is too thin, this results in in a poor solder joint.
• Too much solder paste can cause excess solder on the sides of the package.
• If the package is placed too far into the paste (too close to the board) it can cause excess solder on the sides of the package.
• The solder must adhere to the pads on the package backside and flow up the castellation.
• The package must be parallel to the board (no tilt).
• The package must be aligned to the pads.
• The circuit board pads must be sized to fit the pads on the underside of the package and allow for a fillet on the sides.
• Placement depth must be consistent.
• With mixed package types on the board the actual reflow temperature of the LCCC component must be measured (thermocouple on package via thermally conductive epoxy).