UC1611-SP
- Matched, Four-Diode Monolithic Array
- High Peak Current
- Low-Cost MINIDIP Package
- Low-Forward Voltage
- Parallelable for Lower VF or Higher IF
- Fast Recovery Time
- Military Temperature Range Available
This four-diode array is designed for general purpose use as individual diodes or as a high-speed, high-current bridge. It is particularly useful on the outputs of high-speed power MOSFET drivers where Schottky diodes are needed to clamp any negative excursions caused by ringing on the driven line.These diodes are also ideally suited for use as voltage clamps when driving inductive loads such as relays and solenoids, and to provide a path for current free-wheeling in motor drive applications.The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.This single monolithic chip is fabricated in both hermetic CERDIP and copper-eaded plastic packages. The UC1611 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability: while the UC3611 in plastic has higher current rating over a 0°C to 70°C ambient temperature range.
技術(shù)文檔
設(shè)計(jì)和開發(fā)
如需其他信息或資源,請點(diǎn)擊以下任一標(biāo)題進(jìn)入詳情頁面查看(如有)。
ESDEVM — 適用于 ESD 二極管封裝(包括 0402、0201 等)的通用評估模塊
| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| CDIP (JG) | 8 | Ultra Librarian |
| LCCC (FK) | 20 | Ultra Librarian |
訂購和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)
推薦產(chǎn)品可能包含與 TI 此產(chǎn)品相關(guān)的參數(shù)、評估模塊或參考設(shè)計(jì)。