SLVAEU0A September 2020 – November 2025 LM117HVQML-SP , LM117QML-SP , LM136A-2.5QML-SP , LM137JAN-SP , LM137QML-SP , LM185-1.2QML-SP , LM185-2.5QML-SP , LM2940QML-SP , LM2941QML-SP , LM4050QML-SP , LM723JAN-SP , LP2953QML-SP , TL1431-SP , TPS50601-SP , TPS50601A-SP , TPS7A4501-SP , TPS7H1101-SP , TPS7H1101A-SP , TPS7H1111-SP , TPS7H1121-SP , TPS7H2201-SP , TPS7H2211-SP , TPS7H3301-SP , TPS7H4001-SP , TPS7H4002-SP , TPS7H4011-SP , TPS7H5001-SP , TPS7H5002-SP , TPS7H5003-SP , TPS7H5004-SP , TPS7H6003-SP , TPS7H6013-SP , TPS7H6023-SP , UC1525B-SP , UC1611-SP , UC1705-SP , UC1707-SP , UC1708-SP , UC1709-SP , UC1710-SP , UC1715-SP , UC1823A-SP , UC1825-SP , UC1825A-SP , UC1825B-SP , UC1832-SP , UC1834-SP , UC1842-SP , UC1842A-SP , UC1843-SP , UC1843A-SP , UC1843B-SP , UC1844-SP , UC1844A-SP , UC1845-SP , UC1845A-SP , UC1846-SP , UC1856-SP , UC1863-SP , UC1875-SP , UC1901-SP , UC19432-SP , UCC1806-SP
The following table is a snapshot for reference purposes and may not be current. For package specific information and application notes, see http://www.ti.com/support-packaging/packaging-information.html.
|
Package Group |
Description |
Designator |
|---|---|---|
|
CBGA |
Ceramic Ball Grid Array |
GJN,GLE,GLG,GLK,GNM |
|
CCGA |
Ceramic Column Grid Array |
NAA,NWE |
|
CDBGA |
Ceramic Dimpled Ball Grid Array |
GFP,GGP,GGR,GGZ,GHF,GHM,GJM,GKG,ZGR, ZHM |
|
CDIP |
Ceramic Dual Inline Package |
J,JG,JL,JNA,JNC,JND,JT,JTA,JTB,JTC,NAB,NAY, NAZ,NFE |
|
CDIP-BB |
Ceramic Dual Inline Package – Bottom Braze |
JDE,JDG |
|
CDIP-SB |
Ceramic Dual Inline Package – Side Braze |
JC,JD,JDC,JDD,JDJ,JDK,JDM,JDN,JN,JVA,JVB, JVD,JVE,JVF,NAK |
|
CFCBGA |
Ceramic Flip Chip Ball Grid Array |
AAD,CDZ,CMA,CME,CMQ,CTF,CTJ,CTK,CUB, CUD,CUM,CYC,GDZ,GLL,GLP,GMA,GME, GTF,GTH,GTJ,GTK,GTQ,GUD,GUE,GUF,GUM, ZDZ,ZUF |
|
CFP |
Ceramic Flat Pack |
FAA,HAJ,HAY,HBC,HBD,HBE,HBU,HBY,HD,HE,HF,HFD,HFG,HFH,HFL,HFN,HFP,HFQ, HFR,HFS,HG,HGA,HGF,HH,HKB,HKC,HKD,HKE,HKH,HKJ,HKK,HKN,HKP,HKQ,HKR,HKS, HKT,HKU,HKV,HKW,HKX,HKY,HR,HT,HV,HY, HZ,NAD,PHF,PHG,U,W,WA,WD,WH,WJ,WN |
|
CFP |
Ceramic Flat Pack - Gullwing Formed Leads |
NAC |
|
CLGA |
Ceramic Land Grid Array |
FVA, NAF,ZMA,ZMX |
|
CPGA |
Ceramic Pin Grid Array |
GA,GB,GC,GE,GF,GFA,NAQ,NAR,NAT |
|
CQFP |
Ceramic Quad Flat Pack |
NAU,NBA,NBB,NBC |
|
CTO-92 |
Ceramic Transistor Outline 92 |
HTA |
|
CZIP |
Ceramic Zig-Zag Inline Package |
SV |
|
JLCC |
J Lead Ceramic Chip Carrier |
FJ,FZ,HJ,HJA |
|
LCCC |
Leadless Ceramic Chip Carrier |
FD,FE,FFA,FFC,FFD,FFE,FFF,FFH,FFJ,FFK,FK, FKH,FNC,FPH,FPM,FQ,HL,HM,NAJ |
|
TO-CAN |
Transistor Outline [Metal] Can |
K,LMC,LMD,LME,LMF,LMG,NDS,NDT,NDU, NDV,NEP,NEQ,NER |