SLUSFZ6 September 2025 UCC218915-Q1
ADVANCE INFORMATION
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | UCC218915 | UNIT | |
|---|---|---|---|
| DFP (TSSOP) | |||
| 28 Pins | |||
| RθJA | Junction-to-ambient thermal resistance | 81.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 39.4 | V |
| RθJB | Junction-to-board thermal resistance | 48.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 20.1 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 47.6 | °C/W |