SLUSFZ6 September 2025 UCC218915-Q1
ADVANCE INFORMATION
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
The silicon junction temperature is monitored to prevent the driver IC from damage during overheating conditions. When the device temperature exceeds it's 150°C maximum rating, the NMOS buffer FET driver output, OUTN, is held on so that the main power switch will be held off. The driver output will not turn on the PMOS buffer FET until the temperature recovers to 20°C below the thermal shutdown temperature, TTSDTH. While the driver is in thermal shutdown, the RDY pin on the input side is held low and connected to GND.