SLVSGJ9A May 2024 – October 2025 DRV7308
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
- 5 Absolute Maximum Ratings
- 6 ESD Ratings
- 7 Recommended Operating Conditions
- 8 Thermal Information
- 9 Electrical Characteristics
- 10Timing Diagrams
- 11Typical Characteristics
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12Detailed Description
- 12.1 Overview
- 12.2 Functional Block Diagram
- 12.3 Feature Description
- 12.4 Protections
- 13Application and Implementation
- 14Layout
- 15Revision History
- 16Device and Documentation Support
- 17Mechanical, Packaging, and Orderable Information
16.5 Electrostatic Discharge Caution
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |