ZHCSHD7A January 2018 – April 2020 ADC12DJ2700
PRODUCTION DATA.
Figure 194 to Figure 196 provide examples of the critical traces routed on the device evaluation module (EVM).
Figure 194. Top Layer Routing: Analog Inputs, CLK and SYSREF, DA0-3, DB0-3
Figure 195. GND1 Cutouts to Optimize Impedance of Component Pads
Figure 196. Bottom Layer Routing: Additional CLK Routing, DA4-7, DB4-7