ZHCSID0D April 2016 – June 2018 LMH1226
PRODUCTION DATA.
| DESIGN PARAMETER | REQUIREMENTS |
|---|---|
| IN1± Input AC coupling capacitors | AC Coupling capacitors at IN1± should be 4.7-μF capacitors. Choose small 0402 surface mount ceramic capacitors. This allows both SMPTE and 10 GbE data traffic. |
| Output AC coupling Capacitors | Both OUT0± and OUT1± require AC coupling capacitors. Choose small 0402 surface mount ceramic capacitors. 4.7-μF AC coupling capacitors are recommended. |
| DC power supply decoupling capacitors | Decoupling capacitors are required to minimize power supply noise. Place 10-μF and 1-μF bulk capacitors close to each device. Place a 0.1-μF capacitor close to each supply pin. |
| VDD_LDO decoupling capacitors | Place 1-μF and 0.1-μF surface mount ceramic capacitors as close as possible to the device VDD_LDO pin. |
| High Speed IN1, OUT0, and OUT1 trace impedance | IN1±, OUT0± and OUT1± should be routed with coupled board traces with 100-Ω differential impedance. |
| SFP+ (SFF-8431) return loss | Place SFP module within 1-2 inches of the LMH1226 to minimize insertion and return loss. |
| Use of SPI or SMBus interface | Set MODE_SEL to Level-F (pin unconnected) for SPI. Set MODE_SEL to Level-L (connect 1 kΩ to VSS) for SMBus. SMBus is 3.3 V tolerant. |