ZHCSID0D April 2016 – June 2018 LMH1226
PRODUCTION DATA.
| THERMAL METRIC(1)(2) | LMH1226 | UNIT | |
|---|---|---|---|
| RTW (QFN) | |||
| 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 33.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 28.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 11.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 11.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.2 | °C/W |