10 Revision History
Changes from Revision F (August 2017) to Revision G (February 2025)
- 更新了整個文檔中的表格、圖和交叉參考的編號格式Go
- Updated the Device Comparison section with existing OPNs and adding Device Nomenclature tableGo
- Changed Machine model (MM) Electrostatic discharge to Charged-device model (CDM).Go
- Changed minimum specified temperature for LM60B from -25°C to -40°C in the New chip.Go
- Changed DBZ and LP packages Thermal Information section. in the New chipGo
- Added “operating current” and “Change of quiescent current” for the New chip.Go
- Added graphs for new chip, reordered and corrected the graphs for legacy chipGo
- Added corrections to the Thermal Resistance Junction to Air (Legacy chip) graphGo
- Added Thermal Response in Stirred Oil Bath With Heat Sink (0.5 inches × 0.5 inches PCB board) graph for both Legacy and New chipsGo
- Added Thermal Response in Still Air Without a Heat Sink (Both Legacy and New chip together in a new test setup) graph for both Legacy and New chipsGo
- Added the Start-Up Voltage vs Temperature, Quiescent Current vs Temperature, Accuracy vs Temperature, Noise Voltage, Supply Current vs Supply Voltage and Start-Up Response graphs for New chipGo
Changes from Revision E (September 2015) to Revision F (August 2017)
- 將汽車器件移到了單獨的數據表 (SNIS197) 中Go
- Added table note for the LM60BGo
Changes from Revision D (November 2012) to Revision E (November 2014)
- 添加了引腳配置和功能部分、ESD 等級表、特性說明部分、器件功能模式、應用和實施部分、電源相關建議部分、布局部分、器件和文檔支持部分以及機械、封裝和可訂購信息部分Go