ZHCSGX1G May 2004 – February 2025 LM60
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Device Comparison
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
8.5.3 Thermal Considerations
The thermal resistance junction to ambient (RθJA) is the parameter used to calculate the rise of a device junction temperature due to the device power dissipation. Use Equation 4 to calculate the rise in the die temperature of the device.
Equation 4. TJ = TA + RθJA [(+VS IQ) + (+VS ? VO) IL]
where
- IQ is the quiescent current
- IL is the load current on the output
Table 8-2 summarizes the rise in die temperature of the LM60 without any loading, and the thermal resistance for different conditions. The values in Table 8-2 were actually measured where as the values shown in Section 6.4 where calculated using modeling methods as described in the Semiconductor and IC Package Thermal Metrics (SPRA953) application report.
Table 8-2 Temperature Rise of LM60 Due to Self-Heating and Thermal Resistance (RθJA)
| SOT-23(1) NO HEAT SINK | SOT-23(2) SMALL HEAT FIN | TO-92(1) NO HEAT FIN | TO-92(3) SMALL HEAT FIN | |||||
|---|---|---|---|---|---|---|---|---|
| RθJA | TJ ? TA | RθJA | TJ ? TA | RθJA | TJ ? TA | RθJA | TJ ? TA | |
| (°C/W) | (°C) | (°C/W) | (°C) | (°C/W) | (°C) | (°C/W) | (°C) | |
| Still air Legacy chip | 450 | 0.17 | 260 | 0.1 | 180 | 0.07 | 140 | 0.05 |
| Moving air Legacy chip | — | — | 180 | 0.07 | 90 | 0.034 | 70 | 0.026 |
(1) Part soldered to 30 gauge wire.
(2) Heat sink used is 1/2-in square printed-circuit board with 2-oz. foil with part attached as shown in Figure 8-9.
(3) Part glued or leads soldered to 1-in square of 1/16-in printed-circuit board with 2-oz. foil or similar.
1/2-in Square Printed-Circuit
Board with 2oz. Copper Foil or Similar.
Figure 8-9 Printed-Circuit Board Used for Heat Sink to Generate Thermal Response Curves (Legacy chip)
1/2in Square Printed-Circuit Board with FR-4 material.
Figure 8-10 Printed-Circuit Board Used
to Generate Thermal Response Curves (New Test Setup for Both New Chip and
Legacy Chip)