ZHCSGX1G May 2004 – February 2025 LM60
PRODUCTION DATA
| ORDER NUMBER | PACKAGE | ACCURACY OVER TEMPERATURE | SPECIFIED TEMPERATURE RANGE | |
|---|---|---|---|---|
| LM60BIM3X/NOPB | SOT-23 (DBZ) 3-pin | ±3°C | –25°C ≤ TA ≤ +125°C(1) (Legacy chip) | |
| –40°C ≤ TA ≤ +125°C (New chip) | ||||
| LM60CIM3X/NOPB | ±4°C | –40°C ≤ TA ≤ +125°C | ||
| LM60QIM3X/NOPB | ±4°C | –40°C ≤ TA ≤ +125°C | ||
| LM60BIZ/LFT3 | TO-92 (LP) 3-pin Formed Leads | ±3°C | –25°C ≤ TA ≤ +125°C(1) (Legacy chip) | |
| –40°C ≤ TA ≤ +125°C (New chip) | ||||
| LM60BIZ/NOPB | TO-92 (LP) 3-pin Straight Leads | ±3°C | –25°C ≤ TA ≤ +125°C(1) (Legacy chip) | |
| –40°C ≤ TA ≤ +125°C (New chip) | ||||
| LM60CIZ/NOPB | ±4°C | –40°C ≤ TA ≤ +125°C | ||
| PRODUCT | OUT |
|---|---|
| LM60xIyyy/NOPB LM60xIyyy/LFT3 | x indicates that the device has B, C or Q (grade-1 device in accordance with the AEC-Q100 standard) variant. These devices can ship with the legacy chip (CSO: GF6 or SHE) or the new chip (CSO: RFB) with different date code. The reel packaging label provides date code information to distinguish which chip is being used. Device performance for new and legacy chips is denoted throughout the document. yyy indicates that the package type of the device which can be M3X/NOPB (SOT-23 3-pin) or Z/LFT3 (TO-92 3-pin Formed Leads) or Z/NOPB (TO-92 3-pin Straight Leads). For more information on TO-92 package options please see: TO-92 Packing Options / Ordering Instructions |