ZHCSGX1G May 2004 – February 2025 LM60
PRODUCTION DATA
| THERMAL METRIC(1) | LM60 | UNIT | ||||
|---|---|---|---|---|---|---|
| DBZ (SOT-23) 3 PINS |
LP (TO-92) 3 PINS |
|||||
| Legacy chip | New chip | Legacy chip | New chip | |||
| RθJA(2) | Junction-to-ambient thermal resistance | 266 | 240.6 | 162 | 135.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 135 | 144.5 | 85 | 109.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 59 | 72.3 | - | 108.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 18 | 28.7 | 29 | 24.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 58 | 71.7 | 142 | 108.9 | °C/W |