ZHCSGX1G May 2004 – February 2025 LM60
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Device Comparison
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
8.1.1 Capacitive Loads
The device handles capacitive loading well. Without any special precautions, the device can drive any capacitive load as shown in Figure 8-1. Over the specified temperature range the device has a maximum output impedance of 800Ω. In an extremely noisy environment, adding some filtering to minimize noise pick-up can be required. TI recommends that 0.1μF be added from +VS to GND to bypass the power supply voltage, as shown in Figure 8-2. In a noisy environment, adding a capacitor from the output to ground can be required. A 1μF output capacitor with the 800Ω output impedance forms a 199Hz, low-pass filter. Because the thermal time constant of the device is much slower than the 6.3ms time constant formed by the RC, the overall response time of the device is not be significantly affected. For much larger capacitors, this additional time lag increases the overall response time of the device.
Figure 8-1 No Decoupling Required for Capacitive Load
Figure 8-2 Filter Added for Noisy Environment