ZHCSTD4B September 2019 – October 2023 BQ75614-Q1
PRODUCTION DATA
| THERMAL METRIC | BQ7961x-Q1 | UNIT | |
|---|---|---|---|
| PAP (HTQFP) | |||
| 64 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 21.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 8.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 7.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 7.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.1 | °C/W |