SLUSFH4A March 2025 – July 2025 BQ25858-Q1 , BQ25858B-Q1
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | BQ25858-Q1 | UNIT | |
|---|---|---|---|
| RRV | |||
| 36 PINS | |||
| RθJA | Junction-to-ambient thermal resistance (JEDEC(1)) | 29.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 19.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 10.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 10.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.5 | °C/W |