5 Model Limitations

The RC values representing the thermals of the package are based off calculations assuming JEDEC board, which refers to nominal silicon with a JEDEC standard board. For better adherence to the thermals of your package, new RC networks must be made to reflect your package thermals. For information on PCB layout and when to expect thermal shutdown for each device, reference the Layout Guidelines section of the data sheet for the desired high-side switch. These models are intended as a reference and should be interpreted with these limitations in mind.