| THERMAL METRIC(1) | UCC28700-Q1 | UNIT |
|---|
| DBV |
|---|
| 6 PINS |
|---|
| θJA | Junction-to-ambient thermal
resistance(2) | 180 | °C/W |
| θJCtop | Junction-to-case (top) thermal
resistance(3) | 71.2 |
| θJB | Junction-to-board thermal
resistance(4) | 44.4 |
| ψJT | Junction-to-top
characterization parameter(5) | 5.1 |
| ψJB | Junction-to-board
characterization parameter(6) | 43.8 |
(1) For more information about traditional and new thermal
metrics, see the
Semiconductor and IC Package Thermal Metrics application
report (
SPRA953).
(2) The junction-to-ambient thermal resistance under natural
convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is
obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI
SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by
simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real
system and is extracted from the simulation data for obtaining RθJA,
using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real
system and is extracted from the simulation data for obtaining RθJA,
using a procedure described in JESD51-2a (sections 6 and 7).