ZHCSLM3B August 2020 – May 2024 LP8864-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Pin Configuration and Functions
- 5 Specifications
-
6 Detailed Description
- 6.1 Overview
- 6.2 Functional Block Diagram
- 6.3
Feature Description
- 6.3.1 Control Interface
- 6.3.2 Function Setting
- 6.3.3 Device Supply (VDD)
- 6.3.4 Enable (EN)
- 6.3.5 Charge Pump
- 6.3.6 Boost Controller
- 6.3.7 LED Current Sinks
- 6.3.8 Brightness Control
- 6.3.9
Protection and Fault Detections
- 6.3.9.1 Supply Faults
- 6.3.9.2
Boost Faults
- 6.3.9.2.1 Boost Overvoltage Faults (BSTOVPL, BSTOVPH)
- 6.3.9.2.2 Boost Overcurrent Faults (BSTOCP)
- 6.3.9.2.3 LEDSET Resistor Missing Faults (LEDSET)
- 6.3.9.2.4 MODE Resistor Missing Faults (MODESEL)
- 6.3.9.2.5 FSET Resistor Missing Faults (FSET)
- 6.3.9.2.6 ISET Resistor Out of Range Faults (ISET)
- 6.3.9.2.7 Thermal Shutdown Faults (TSD)
- 6.3.9.3 LED Faults
- 6.3.9.4 Overview of the Fault and Protection Schemes
- 6.4 Device Functional Modes
- 6.5 Programming
-
7 Application and Implementation
- 7.1 Application Information
- 7.2
Typical Applications
- 7.2.1
Full Feature Application for Display Backlight
- 7.2.1.1 Design Requirements
- 7.2.1.2
Detailed Design Procedure
- 7.2.1.2.1 Inductor Selection
- 7.2.1.2.2 Output Capacitor Selection
- 7.2.1.2.3 Input Capacitor Selection
- 7.2.1.2.4 Charge Pump Output Capacitor
- 7.2.1.2.5 Charge Pump Flying Capacitor
- 7.2.1.2.6 Output Diode
- 7.2.1.2.7 Switching FET
- 7.2.1.2.8 Boost Sense Resistor
- 7.2.1.2.9 Power-Line FET
- 7.2.1.2.10 Input Current Sense Resistor
- 7.2.1.2.11 Feedback Resistor Divider
- 7.2.1.2.12 Critical Components for Design
- 7.2.1.3 Application Curves
- 7.2.2 Application with Basic/Minimal Operation
- 7.2.3
SEPIC Mode Application
- 7.2.3.1 Design Requirements
- 7.2.3.2
Detailed Design Procedure
- 7.2.3.2.1 Inductor Selection
- 7.2.3.2.2 Coupling Capacitor Selection
- 7.2.3.2.3 Output Capacitor Selection
- 7.2.3.2.4 Input Capacitor Selection
- 7.2.3.2.5 Charge Pump Output Capacitor
- 7.2.3.2.6 Charge Pump Flying Capacitor
- 7.2.3.2.7 Switching FET
- 7.2.3.2.8 Output Diode
- 7.2.3.2.9 Switching Sense Resistor
- 7.2.3.2.10 Power-Line FET
- 7.2.3.2.11 Input Current Sense Resistor
- 7.2.3.2.12 Feedback Resistor Divider
- 7.2.3.2.13 Critical Components for Design
- 7.2.3.3 Application Curves
- 7.2.1
Full Feature Application for Display Backlight
- 7.3 Power Supply Recommendations
- 7.4 Layout
- 8 Register Maps
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
7.2.3.2.2 Coupling Capacitor Selection
The coupling capacitors Cs isolate the input from the output and provide protection against a shorted load. The selection of SEPIC capacitors, Cs, depends mostly on the RMS current, which can be calculated with Equation 27. The capacitors must be rated for a large RMS current relative to the output power; TI recommends at least 25% higher rating for IRMS. When using uncoupled inductors, use one 10μF ceramic capacitor in parallel with one 33μF electrolytic capacitor and series 2? resistor. If coupled inductors are used, then use only one 10μF ceramic capacitor.
where
- ICs(rms): RMS current of Cs capacitor
- IOUT: Output current
- VOUT: Output voltage
- VD: Diode forward voltage drop
- VIN(min): Minimum input voltage