ZHCSHW2I June 2007 – September 2018 LM2735
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Applications
- 8.2.1 LM2735X SOT-23 Design Example 1
- 8.2.2 LM2735Y SOT-23 Design Example 2
- 8.2.3 LM2735X WSON Design Example 3
- 8.2.4 LM2735Y WSON Design Example 4
- 8.2.5 LM2735Y MSOP-PowerPAD Design Example 5
- 8.2.6 LM2735X SOT-23 Design Example 6
- 8.2.7 LM2735Y SOT-23 Design Example 7
- 8.2.8 LM2735X SOT-23 Design Example 8
- 8.2.9 LM2735Y SOT-23 Design Example 9
- 8.2.10 LM2735X WSON Design Example 10
- 8.2.11 LM2735Y WSON Design Example 11
- 8.2.12 LM2735X WSON SEPIC Design Example 12
- 8.2.13 LM2735Y MSOP-PowerPAD SEPIC Design Example 13
- 8.2.14 LM2735X SOT-23 LED Design Example 14
- 8.2.15 LM2735Y WSON FlyBack Design Example 15
- 8.2.16 LM2735X SOT-23 LED Design Example 16 VRAIL > 5.5 V Application
- 8.2.17 LM2735X SOT-23 LED Design Example 17 Two-Input Voltage Rail Application
- 8.2.18 SEPIC Converter
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- DGN|8
訂購信息
10.3.3 LM2735 Thermal Models
Heat is dissipated from the LM2735 and other devices. The external loss elements include the Schottky diode, inductor, and loads. All loss elements will mutually increase the heat on the PCB, and therefore increase each other’s temperatures.
Figure 47. Thermal Schematic 
Figure 48. Associated Thermal Model