ZHCSHW2I June 2007 – September 2018 LM2735
PRODUCTION DATA.
| THERMAL METRIC(1) | LM2735 | UNIT | |||
|---|---|---|---|---|---|
| NGG (WSON) | DBV (SOT-23) | DGN (MSOP-PowerPAD) | |||
| 6 PINS | 5 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(2) | 54.9 | 164.2 | 59 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance(2) | 50.9 | 115.3 | 51.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 29.3 | 27 | 35.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.7 | 12.8 | 2.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 29.4 | 26.5 | 35.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 9.3 | N/A | 7.3 | °C/W |