ZHCSR67 July 2020 DRV8353M
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Absolute Maximum Ratings
- 8 ESD Ratings
- 9 Recommended Operating Conditions
- 10Thermal Information
- 11Electrical Characteristics
- 12SPI Timing Requirements
-
13Detailed Description
- 13.1 Overview
- 13.2 Functional Block Diagram
- 13.3
Feature Description
- 13.3.1 Three Phase Smart Gate Drivers
- 13.3.2 DVDD Linear Voltage Regulator
- 13.3.3 Pin Diagrams
- 13.3.4 Low-Side Current-Shunt Amplifiers
- 13.3.5
Gate Driver Protective Circuits
- 13.3.5.1 VM Supply and VDRAIN Undervoltage Lockout (UVLO)
- 13.3.5.2 VCP Charge-Pump and VGLS Regulator Undervoltage Lockout (GDUV)
- 13.3.5.3 MOSFET VDS Overcurrent Protection (VDS_OCP)
- 13.3.5.4 VSENSE Overcurrent Protection (SEN_OCP)
- 13.3.5.5 Gate Driver Fault (GDF)
- 13.3.5.6 Overcurrent Soft Shutdown (OCP Soft)
- 13.3.5.7 Thermal Warning (OTW)
- 13.3.5.8 Thermal Shutdown (OTSD)
- 13.3.5.9 Fault Response Table
- 13.4 Device Functional Modes
- 13.5 Programming
- 13.6
Register Maps
- 13.6.1 Status Registers
- 13.6.2
Control Registers
- 13.6.2.1 Driver Control Register (address = 0x02h)
- 13.6.2.2 Gate Drive HS Register (address = 0x03h)
- 13.6.2.3 Gate Drive LS Register (address = 0x04h)
- 13.6.2.4 OCP Control Register (address = 0x05h)
- 13.6.2.5 CSA Control Register (address = 0x06h)
- 13.6.2.6 Driver Configuration Register (address = 0x07h)
-
14Application and Implementation
- 14.1 Application Information
- 14.2
Typical Application
- 14.2.1
Primary Application
- 14.2.1.1 Design Requirements
- 14.2.1.2 Detailed Design Procedure
- 14.2.1.3 Application Curves
- 14.2.1
Primary Application
- 15Power Supply Recommendations
- 16Layout
- 17Device and Documentation Support
- 18Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RTA|40
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RTA|40
訂購(gòu)信息
17.6 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |