ZHCSJU7 May 2019 DRV8340-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1
Three Phase Smart Gate Drivers
- 8.3.1.1
PWM Control Modes
- 8.3.1.1.1 6x PWM Mode (PWM_MODE = 000b or MODE Pin Tied to AGND)
- 8.3.1.1.2 3x PWM Mode (PWM_MODE = 001b or MODE Pin = 18 kΩ to AGND)
- 8.3.1.1.3 1x PWM Mode (PWM_MODE = 010b or MODE Pin = 75 kΩ to AGND)
- 8.3.1.1.4 Independent Half-Bridge PWM Mode (PWM_MODE = 011b or MODE Pin is > 1.5 MΩ to AGND or Hi-Z)
- 8.3.1.1.5 Phases A and B are Independent Half-Bridges, Phase C is Independent FET (MODE = 100b)
- 8.3.1.1.6 Phases B and C are Independent Half-Bridges, Phase A is Independent FET (MODE = 101b or MODE Pin is 75 kΩ to DVDD)
- 8.3.1.1.7 Phases A is Independent Half-Bridge, Phases B and C are Independent FET (MODE = 110b or MODE Pin is 18 kΩ to DVDD)
- 8.3.1.1.8 Independent MOSFET Drive Mode (PWM_MODE = 111b or MODE Pin = 0.47 kΩ to DVDD)
- 8.3.1.2 Device Interface Modes
- 8.3.1.3 Gate Driver Voltage Supplies
- 8.3.1.4 Smart Gate Drive Architecture
- 8.3.1.1
PWM Control Modes
- 8.3.2 DVDD Linear Voltage Regulator
- 8.3.3 Pin Diagrams
- 8.3.4
Gate Driver Protective Circuits
- 8.3.4.1 VM Supply Undervoltage Lockout (UVLO)
- 8.3.4.2 VCP Charge Pump Undervoltage Lockout (CPUV)
- 8.3.4.3 MOSFET VDS Overcurrent Protection (VDS_OCP)
- 8.3.4.4 Gate Driver Fault (GDF)
- 8.3.4.5 Thermal Warning (OTW)
- 8.3.4.6 Thermal Shutdown (OTSD)
- 8.3.4.7 Open Load Detection (OLD)
- 8.3.4.8 Offline Shorts Diagnostics
- 8.3.4.9 Reverse Supply Protection
- 8.3.1
Three Phase Smart Gate Drivers
- 8.4 Device Functional Modes
- 8.5 Programming
- 8.6
Register Maps
- 8.6.1 Status Registers
- 8.6.2
Control Registers
- 8.6.2.1 IC1 Control Register (Address = 0x04) [reset = 0x00]
- 8.6.2.2 IC2 Control Register (address = 0x05) [reset = 0x40]
- 8.6.2.3 IC3 Control Register (Address = 0x06) [reset = 0xFF]
- 8.6.2.4 IC4 Control Register (Address = 0x07) [reset = 0xFF]
- 8.6.2.5 IC5 Control Register (Address = 0x08) [reset = 0xFF]
- 8.6.2.6 IC6 Control Register (Address = 0x09) [reset = 0x99]
- 8.6.2.7 IC7 Control Register (Address = 0x0A) [reset = 0x99]
- 8.6.2.8 IC8 Control Register (Address = 0x0B) [reset = 0x99]
- 8.6.2.9 IC9 Control Register (Address = 0x0C) [reset = 0x2F]
- 8.6.2.10 IC10 Control Register (Address = 0x0D) [reset = 0x61]
- 8.6.2.11 IC11 Control Register (Address = 0x0E) [reset = 0x00]
- 8.6.2.12 IC12 Control Register (Address = 0x0F) [reset = 0x2A]
- 8.6.2.13 IC13 Control Register (Address = 0x10) [reset = 0x7F]
- 8.6.2.14 IC14 Control Register (Address = 0x10) [reset = 0x00]
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PHP|48
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PHP|48
訂購(gòu)信息
8.3.4.8.2 Offline Short-to-Ground Diagnostic (SHT_GND)
When the EN_SHT_TST bit is set high, all the pullup current sources on the SHx pins are enabled. The voltage across each pullup source is individually measured and compared to an internal threshold (VTH). If the voltage across any of the current sources exceeds VTH, the DRV8340-Q1 device flags that as a fault condition. The nFAULT pin is driven low, and in the SPI device the FAULT, OL_SHT, and the corresponding SHT_GND_x bit is set. Figure 32 shows the internal circuit for the short-to-ground detection.
Figure 32. Offline Short-to-Ground Detection Circuit In the SPI device, depending on the load configuration, SHT_GND on one phase can latch all three SHT_GND_x bits high. To determine which phase has a short-to-ground fault condition, the external MOSFETs can be enabled and the appropriate VDS_Hx fault bit is latched indicating the faulty phase node. SHT_GND is not supported for load configurations shown in Figure 29.