ZHCSG47D February 2017 – June 2025 TPS7B63-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TPS7B63-Q1 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 39.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 28.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 23.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 23.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.1 | °C/W |