ZHCSGE0B June 2017 – January 2019 TPS53681
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Supply: Currents, UVLO, and Power-On Reset
- 6.6 References: DAC and VREF
- 6.7 Voltage Sense: AVSP and BVSP, AVSN and BVSN
- 6.8 Telemetry
- 6.9 Input Current Sensing
- 6.10 Programmable Loadline Settings
- 6.11 Current Sense and Calibration
- 6.12 Logic Interface Pins: AVR_EN, AVR_RDY, BVR_EN, BVR_RDY, RESET, VR_FAULT, VR_HOT
- 6.13 I/O Timing
- 6.14 PMBus Address Setting
- 6.15 Overcurrent Limit Thresholds
- 6.16 Switching Frequency
- 6.17 Slew Rate Settings
- 6.18 Ramp Selections
- 6.19 Dynamic Integration and Undershoot Reduction
- 6.20 Boot Voltage and TMAX Settings
- 6.21 Protections: OVP and UVP
- 6.22 Protections: ATSEN and BTSEN Pin Voltage Levels and Fault
- 6.23 PWM: I/O Voltage and Current
- 6.24 Dynamic Phase Add and Drop
- 6.25 Typical Characteristics
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4 Device Functional Modes
- 7.5
Programming
- 7.5.1 PMBus Connections
- 7.5.2 PMBus Address Selection
- 7.5.3 Supported Commands
- 7.5.4 Commonly Used PMBus Commands
- 7.5.5 Voltage, Current, Power, and Temperature Readings
- 7.5.6 Input Current Sense and Calibration
- 7.5.7 Output Current Sense and Calibration
- 7.5.8 Output Voltage Margin Testing
- 7.5.9 Loop Compensation
- 7.5.10 Converter Protection and Response
- 7.5.11 Output Overvoltage Protection and Response
- 7.5.12 Maximum Allowed Output Voltage Setting
- 7.5.13 Output Undervoltage Protection and Response
- 7.5.14 Minimum Allowed Output Voltage Setting
- 7.5.15 Output Overcurrent Protection and Response
- 7.5.16 Input Under-Voltage Lockout (UVLO)
- 7.5.17 Input Over-Voltage Protection and Response
- 7.5.18 Input Undervoltage Protection and Response
- 7.5.19 Input Overcurrent Protection and Response
- 7.5.20 Over-Temperature Protection and Response
- 7.5.21 Dynamic Phase Shedding (DPS)
- 7.5.22 NVM Programming
- 7.5.23 NVM Security
- 7.5.24 Black Box Recording
- 7.5.25 Board Identification and Inventory Tracking
- 7.5.26 Status Reporting
-
8 Applications, Implementation, and Layout
- 8.1 Application Information
- 8.2 Typical Application
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSB|40
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSB|40
訂購信息
7.3.1.3 Temperature and Fault Sensing
TI smart power stage senses the die temperature and sends out the temperature information as a voltage through the TAO pin. In a multi-phase application, the TAO pin of the TI smart power stages are connected together and then tied to the ATSEN and BTSEN pins of the TPS53681 device. In this case, the device reports the temperature of the hottest power stage. The reported temperature can be calculated as shown in Equation 1.
where
- TEMP is the sensed temperature in °C
- VTSEN is the voltage at ATSEN and BTSEN pins
TSEN signal is also used as an indicator for power stage fault. When an internal fault occurs in the TI smart power stage, the power stage pulls the xTAO pins high. If the TSEN voltage is higher than 2.5 V, the TPS53681 device senses the fault and turns off both the high-side and the low-side MOSFETS.
The TSEN signal is also used to indicate hand-shaking between the controller and the power stages. If the power stages are not powered, the TAO pin is pulled down to prevent switching, even if the controller is enabled.
Figure 9. Temperature Sense