ZHCSGE0B June 2017 – January 2019 TPS53681
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Supply: Currents, UVLO, and Power-On Reset
- 6.6 References: DAC and VREF
- 6.7 Voltage Sense: AVSP and BVSP, AVSN and BVSN
- 6.8 Telemetry
- 6.9 Input Current Sensing
- 6.10 Programmable Loadline Settings
- 6.11 Current Sense and Calibration
- 6.12 Logic Interface Pins: AVR_EN, AVR_RDY, BVR_EN, BVR_RDY, RESET, VR_FAULT, VR_HOT
- 6.13 I/O Timing
- 6.14 PMBus Address Setting
- 6.15 Overcurrent Limit Thresholds
- 6.16 Switching Frequency
- 6.17 Slew Rate Settings
- 6.18 Ramp Selections
- 6.19 Dynamic Integration and Undershoot Reduction
- 6.20 Boot Voltage and TMAX Settings
- 6.21 Protections: OVP and UVP
- 6.22 Protections: ATSEN and BTSEN Pin Voltage Levels and Fault
- 6.23 PWM: I/O Voltage and Current
- 6.24 Dynamic Phase Add and Drop
- 6.25 Typical Characteristics
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4 Device Functional Modes
- 7.5
Programming
- 7.5.1 PMBus Connections
- 7.5.2 PMBus Address Selection
- 7.5.3 Supported Commands
- 7.5.4 Commonly Used PMBus Commands
- 7.5.5 Voltage, Current, Power, and Temperature Readings
- 7.5.6 Input Current Sense and Calibration
- 7.5.7 Output Current Sense and Calibration
- 7.5.8 Output Voltage Margin Testing
- 7.5.9 Loop Compensation
- 7.5.10 Converter Protection and Response
- 7.5.11 Output Overvoltage Protection and Response
- 7.5.12 Maximum Allowed Output Voltage Setting
- 7.5.13 Output Undervoltage Protection and Response
- 7.5.14 Minimum Allowed Output Voltage Setting
- 7.5.15 Output Overcurrent Protection and Response
- 7.5.16 Input Under-Voltage Lockout (UVLO)
- 7.5.17 Input Over-Voltage Protection and Response
- 7.5.18 Input Undervoltage Protection and Response
- 7.5.19 Input Overcurrent Protection and Response
- 7.5.20 Over-Temperature Protection and Response
- 7.5.21 Dynamic Phase Shedding (DPS)
- 7.5.22 NVM Programming
- 7.5.23 NVM Security
- 7.5.24 Black Box Recording
- 7.5.25 Board Identification and Inventory Tracking
- 7.5.26 Status Reporting
-
8 Applications, Implementation, and Layout
- 8.1 Application Information
- 8.2 Typical Application
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSB|40
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSB|40
訂購(gòu)信息
8.2.1.3.1 Choose Inductor
Smaller inductance values yield better transient performance, but also have a higher ripple and lower efficiency. Higher inductance values have the opposite characteristics. It is common practice to limit the ripple current to between 30% and 45% of the maximum per-phase current. In this design example, 30% of the maximum per-phase current is used.
Equation 4. 
Equation 5. 
A standard inductor value of 150 nH with 0.18 mΩ DCR is chosen. With the same design procedure, the inductor value for the Rail B (VOUTB) of 150 nH is chosen.