ZHCSP56 September 2023 TPS1HTC30-Q1
PRODUCTION DATA
| THERMAL METRIC(1)(2) | TPS1HTC30 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 23.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 7.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 7.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.5 | °C/W |