ZHCSP56 September 2023 TPS1HTC30-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
9.4.2.1 Without a GND Network
Without a GND network, tie the thermal pad directly to the board GND copper for better thermal performance.
Figure 9-7 Layout Without a GND Network