ZHCSDD8D October 2014 – December 2019 TPS1H100-Q1
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Accurate Current Sense
- 7.3.2 Programmable Current Limit
- 7.3.3 Inductive-Load Switching-Off Clamp
- 7.3.4
Full Protections and Diagnostics
- 7.3.4.1 Short-to-GND and Overload Detection
- 7.3.4.2 Open-Load Detection
- 7.3.4.3 Short-to-Battery Detection
- 7.3.4.4 Reverse-Polarity Detection
- 7.3.4.5 Thermal Protection Behavior
- 7.3.4.6 UVLO Protection
- 7.3.4.7 Loss of GND Protection
- 7.3.4.8 Loss of Power Supply Protection
- 7.3.4.9 Reverse Current Protection
- 7.3.4.10 Protection for MCU I/Os
- 7.3.5 Diagnostic Enable Function
- 7.4 Device Functional Modes
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
6.4 Thermal Information
| THERMAL METRIC(1) | TPS1H100-Q1 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance (2) | 41 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 29.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 25.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 24.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.7 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The thermal data is based on JEDEC standard high-K profile – JESD 51-7. The copper pad is soldered to the thermal land pattern. Also, correct attachment procedure must be incorporated.
1. 4-layer board: FR4 2s2p board, 2.8-mil copper (top/bottom), 1.4-mil copper (internal layers). 76.4- × 114.3- × 1.5-mm board size.
2. 2-layer board: FR4 2s0p board, 2.8-mil copper (top/bottom). 76.4- × 114.3- × 1.5-mm board size.
Figure 1. RθJA Value vs Copper Area