ZHCSSV5 January 2024 TMP119
PRODUCTION DATA
| THERMAL METRIC(1) | TMP119 | UNITS | |
|---|---|---|---|
| YBG (DSBGA) | |||
| 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 133.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 1.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |
| RθJB | Junction-to-board thermal resistance | 40.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 40.7 | °C/W |
| MT | Thermal Mass | 0.7 | mJ/°C |