ZHCSSV5 January   2024 TMP119

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 應(yīng)用
4. 3 說(shuō)明
5. 4 Device Comparison
6. 5 Pin Configuration and Functions
7. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Switching Characteristics
   7. 6.7 Two-Wire Interface Timing
   8. 6.8 Timing Diagram
   9. 6.9 Typical Characteristics
8. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Averaging
      3. 7.3.3 Temperature Result and Limits
      4. 7.3.4 Strain Tolerance
   4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 Shutdown Mode (SD)
      3. 7.4.3 One-Shot Mode (OS)
      4. 7.4.4 Therm and Alert Modes
         1. 7.4.4.1 Alert Mode
         2. 7.4.4.2 Therm Mode
   5. 7.5 Programming
      1. 7.5.1 EEPROM Programming
         1. 7.5.1.1 EEPROM Overview
         2. 7.5.1.2 Programming the EEPROM
      2. 7.5.2 Pointer Register
      3. 7.5.3 I2C and SMBus Interface
         1. 7.5.3.1 Serial Interface
            1. 7.5.3.1.1 Bus Overview
            2. 7.5.3.1.2 Serial Bus Address
            3. 7.5.3.1.3 Writing and Reading Operation
            4. 7.5.3.1.4 Target Mode Operations
               1. 7.5.3.1.4.1 Target Receiver Mode
               2. 7.5.3.1.4.2 Target Transmitter Mode
            5. 7.5.3.1.5 SMBus Alert Function
            6. 7.5.3.1.6 General-Call Reset Function
            7. 7.5.3.1.7 Timeout Function
            8. 7.5.3.1.8 Timing Diagrams
9. 8 Application and Implementation
   1. 8.1 Application Information
      1. 8.1.1 C-Code Decoding Temperature Data
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 Noise and Averaging
         2. 8.2.2.2 Self-Heating Effect (SHE)
         3. 8.2.2.3 Synchronized Temperature Measurements
      3. 8.2.3 Application Curves
   3. 8.3 Power Supply Recommendations
   4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
   5. 8.5 Register Map
10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
       1. 9.1.1 Related Documentation
    2. 9.2 接收文檔更新通知
    3. 9.3 支持資源
    4. 9.4 Trademarks
    5. 9.5 靜電放電警告
    6. 9.6 術(shù)語(yǔ)表
11. 10Revision History
12. 11Mechanical, Packaging, and Orderable Information