ZHCSE15F July 2015 – May 2018 SN65DP159 , SN75DP159
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 說明 （續）
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Power Supply Electrical Characteristics
- 7.6 Differential Input Electrical Characteristics
- 7.7 HDMI and DVI TMDS Output Electrical Characteristics
- 7.8 AUX, DDC, and I2C Electrical Characteristics
- 7.9 HPD Electrical Characteristics
- 7.10 HDMI and DVI Main Link Switching Characteristics
- 7.11 AUX Switching Characteristics (Only for RGZ Package)
- 7.12 HPD Switching Characteristics
- 7.13 DDC and I2C Switching Characteristics
- 7.14 Typical Characteristics
- 8 Parameter Measurement Information
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3
Feature Description
- 9.3.1 Reset Implementation
- 9.3.2 Operation Timing
- 9.3.3 I2C-over-AUX to DDC Bridge (SNx5DP159 48-Pin Package Version Only)
- 9.3.4 Input Lane Swap and Polarity Working
- 9.3.5 Main Link Inputs
- 9.3.6 Main Link Inputs Debug Tools
- 9.3.7 Receiver Equalizer
- 9.3.8 Termination Impedance Control
- 9.3.9 TMDS Outputs
- 9.4 Device Functional Modes
- 9.5 Register Maps
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13器件和文檔支持
- 14機械、封裝和可訂購信息
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
訂購信息
13.6 靜電放電警告
ESD 可能會損壞該集成電路。德州儀器 (TI) 建議通過適當的預防措施處理所有集成電路。如果不遵守正確的處理措施和安裝程序 , 可能會損壞集成電路。
ESD 的損壞小至導致微小的性能降級 , 大至整個器件故障。 精密的集成電路可能更容易受到損壞 , 這是因為非常細微的參數更改都可能會導致器件與其發布的規格不相符。