ZHCSH29B April   2017  – December 2018 LP87524B-Q1 , LP87524J-Q1 , LP87524P-Q1

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
   1.     簡(jiǎn)化原理圖
3. 3 說明
   1.     效率與輸出電流間的關(guān)系
4. 4 修訂歷史記錄
   1.     Device Images
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 I2C Serial Bus Timing Requirements
   7. 6.7 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Descriptions
      1. 7.3.1 DC-DC Converters
         1. 7.3.1.1 Overview
         2. 7.3.1.2 Transition Between PWM and PFM Modes
         3. 7.3.1.3 Buck Converter Load-Current Measurement
         4. 7.3.1.4 Spread-Spectrum Mode
      2. 7.3.2 Sync Clock Functionality
      3. 7.3.3 Power-Up
      4. 7.3.4 Regulator Control
         1. 7.3.4.1 Enabling and Disabling Regulators
         2. 7.3.4.2 Changing Output Voltage
      5. 7.3.5 Enable and Disable Sequences
      6. 7.3.6 Device Reset Scenarios
      7. 7.3.7 Diagnosis and Protection Features
         1. 7.3.7.1 Power-Good Information (PGOOD pin)
         2. 7.3.7.2 Warnings for Diagnosis (Interrupt)
            1. 7.3.7.2.1 Output Power Limit
            2. 7.3.7.2.2 Thermal Warning
         3. 7.3.7.3 Protection (Regulator Disable)
            1. 7.3.7.3.1 Short-Circuit and Overload Protection
            2. 7.3.7.3.2 Overvoltage Protection
            3. 7.3.7.3.3 Thermal Shutdown
         4. 7.3.7.4 Fault (Power Down)
            1. 7.3.7.4.1 Undervoltage Lockout
      8. 7.3.8 GPIO Signal Operation
      9. 7.3.9 Digital Signal Filtering
   4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
   5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
         1. 7.5.1.1 Data Validity
         2. 7.5.1.2 Start and Stop Conditions
         3. 7.5.1.3 Transferring Data
         4. 7.5.1.4 I2C-Compatible Chip Address
         5. 7.5.1.5 Auto-Increment Feature
   6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
         1. 7.6.1.1  OTP_REV
         2. 7.6.1.2  BUCK0_CTRL1
         3. 7.6.1.3  BUCK1_CTRL1
         4. 7.6.1.4  BUCK2_CTRL1
         5. 7.6.1.5  BUCK3_CTRL1
         6. 7.6.1.6  BUCK0_VOUT
         7. 7.6.1.7  BUCK0_FLOOR_VOUT
         8. 7.6.1.8  BUCK1_VOUT
         9. 7.6.1.9  BUCK1_FLOOR_VOUT
         10. 7.6.1.10 BUCK2_VOUT
         11. 7.6.1.11 BUCK2_FLOOR_VOUT
         12. 7.6.1.12 BUCK3_VOUT
         13. 7.6.1.13 BUCK3_FLOOR_VOUT
         14. 7.6.1.14 BUCK0_DELAY
         15. 7.6.1.15 BUCK1_DELAY
         16. 7.6.1.16 BUCK2_DELAY
         17. 7.6.1.17 BUCK3_DELAY
         18. 7.6.1.18 GPIO2_DELAY
         19. 7.6.1.19 GPIO3_DELAY
         20. 7.6.1.20 RESET
         21. 7.6.1.21 CONFIG
         22. 7.6.1.22 INT_TOP1
         23. 7.6.1.23 INT_TOP2
         24. 7.6.1.24 INT_BUCK_0_1
         25. 7.6.1.25 INT_BUCK_2_3
         26. 7.6.1.26 TOP_STAT
         27. 7.6.1.27 BUCK_0_1_STAT
         28. 7.6.1.28 BUCK_2_3_STAT
         29. 7.6.1.29 TOP_MASK1
         30. 7.6.1.30 TOP_MASK2
         31. 7.6.1.31 BUCK_0_1_MASK
         32. 7.6.1.32 BUCK_2_3_MASK
         33. 7.6.1.33 SEL_I_LOAD
         34. 7.6.1.34 I_LOAD_2
         35. 7.6.1.35 I_LOAD_1
         36. 7.6.1.36 PGOOD_CTRL1
         37. 7.6.1.37 PGOOD_CTRL2
         38. 7.6.1.38 PGOOD_FLT
         39. 7.6.1.39 PLL_CTRL
         40. 7.6.1.40 PIN_FUNCTION
         41. 7.6.1.41 GPIO_CONFIG
         42. 7.6.1.42 GPIO_IN
         43. 7.6.1.43 GPIO_OUT
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
         1. 8.2.1.1 Inductor Selection
         2. 8.2.1.2 Input Capacitor Selection
         3. 8.2.1.3 Output Capacitor Selection
         4. 8.2.1.4 Snubber Components
         5. 8.2.1.5 Supply Filtering Components
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
11. 11器件和文檔支持
    1. 11.1 器件支持
       1. 11.1.1 第三方產(chǎn)品免責(zé)聲明
    2. 11.2 接收文檔更新通知
    3. 11.3 社區(qū)資源
    4. 11.4 商標(biāo)
    5. 11.5 靜電放電警告
    6. 11.6 術(shù)語表
12. 12機(jī)械、封裝和可訂購(gòu)信息