ZHCSIK7C July 2018 – June 2025 ESD321
PRODUCTION DATA
| THERMAL METRIC (1) | ESD321 | UNIT | ||
|---|---|---|---|---|
| DYA (SOD-523) | DPY (X1SON) | |||
| 2 Pins | 2 Pins | |||
| RθJA | Junction-to-ambient thermal resistance | 774.7 | 437.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 462.3 | 249.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 541.1 | 169.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 164.4 | 99.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 534.6 | 168.6 | °C/W |