ZHCSEP5D January 2016 – November 2018 DRV8884
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Stepper Motor Driver Current Ratings
- 7.3.2 PWM Motor Drivers
- 7.3.3 Microstepping Indexer
- 7.3.4 Current Regulation
- 7.3.5 Controlling RREF With an MCU DAC
- 7.3.6 Decay Modes
- 7.3.7 Blanking Time
- 7.3.8 Charge Pump
- 7.3.9 LDO Voltage Regulator
- 7.3.10 Logic and Multi-Level Pin Diagrams
- 7.3.11 Protection Circuits
- 7.4 Device Functional Modes
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
7.3.6.2 Mode 2: Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
Figure 19. Slow/Mixed Decay Mode Mixed decay begins as fast decay for a time, followed by slow decay for the remainder of tOFF. In this mode, mixed decay only occurs during decreasing current. Slow decay is used for increasing current.
This mode exhibits the same current ripple as slow decay for increasing current, since for increasing current, only slow decay is used. For decreasing current, the ripple is larger than slow decay, but smaller than fast decay. On decreasing current steps, mixed decay settles to the new ITRIP level faster than slow decay.