ZHCSG08E October 2016 – January 2021 DRV8702-Q1 , DRV8703-Q1
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | DRV870x-Q1 | UNIT | |
|---|---|---|---|
| RHB (VQFN) | |||
| 32 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 32.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 19.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 6.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 6.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.8 | °C/W |