ZHCSND1A November 2020 – May 2022 DRV8434
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 規(guī)格
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7 詳細(xì)說(shuō)明
- 7.1 概述
- 7.2 功能模塊圖
- 7.3 特性說(shuō)明
- 7.4 器件功能模式
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RGE|24
訂購(gòu)信息
7.3.6.2 Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
Figure 7-9 Slow-Mixed Decay ModeMixed decay begins as fast decay for an initial duration of the tOFF, followed by slow decay for the remainder of the tOFF time. Mixed decay only occurs during decreasing current. Slow decay is used for increasing current.
This decay mode exhibits the same current ripple as slow decay mode does for increasing current, because for increasing current, only slow decay is used in this mode. For decreasing current, the ripple is larger than slow decay, but smaller than fast decay. On decreasing current steps, mixed decay settles to the new ITRIP level faster than slow decay.