ZHCSIS3D September 2018 – June 2025 DP83869HM
PRODUCTION DATA
| THERMAL METRIC(1) | 48PIN VQFN | UNIT | |
|---|---|---|---|
| RθJA | Junction-to-ambient thermal resistance | 30.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 18.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 7.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 7.5 | °C/W |