ZHCSSP1 july 2023 BQ25173-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | BQ25173-Q1 | UNIT | |
|---|---|---|---|
| DRC | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance (JEDEC(1)) | 60.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 73.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 34.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 6.0 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 34.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 16.7 | °C/W |