6 Test Setup and Procedures

SEE testing was performed on a CDCLVP111-SEP device, which was mounted on a high-performance evaluation board. The board was powered up using two of the four channels of an Agilent N6702A precision power supply. The twenty single-ended (ten if differential) outputs of the DUT were loaded with 50Ω to GND. The SEE events were monitored by using the Tektronix DPO7254C Digital Phosphor Oscilloscope (four-channel, 40GS/s). The scope has a 3.2μs update rate under the conditions used when collecting data at the TAMU facility. The inputs to the MUX of the CDCLVP111-SEP were provided by using two radio frequency signal generators. The differential inputs CLK0 and CLK1 was provided by means of Rohde and Schwarz SGS100A RF Source. Signals from the signal generator were connected to the board by using high-speed SMA coaxial cables model: S141MMHF- 36-2. The outputs were monitored by using two P6330 (3.5GHz of bandwidth) differential probes attached to the board by a 2.54mm pitch male header.

During the SET testing, the currents on both power supplies were monitored at all times by using an inhouse LabVIEW software GUI (PXI Rad-Test) running on a National Instruments NI-PXIe-8135 controller. This graphical user interface (GUI) also records the beam start and stop output signal on the TAMU system. The signal generators were controlled by means of the general-purpose interface bus (GPIB) protocol using their respective drivers running on the LabVIEW software. The DPO7254C device was controlled by using this front panel interface. The DPO was left on the cave at all times; however, a KVM extender was used to control it from upstairs (in the TAMU control room). TAMU provides an input signal named NIM which can be used to stop the beam after a predetermined number of events and also record the events on the system. The OUT signal of the DPO was connected to the NIM input. Figure 6-1 shows a block diagram of the setup used during the SEE testing. Table 6-1 lists the equipment setup. The device was heated using a convection heat gun aimed at the die for the SEL testing. The junction temperature was monitored by using a digital infrared camera attached as close as possible to the die.

All equipment was controlled and monitored using a custom-developed LabVIEW? program (PXI-RadTest) running on a HP-Z4 desktop computer. The computer communicates with the PXI chassis via an MXI controller and NI PXIe-8381 remote control module.

Equipment Settings and Parameters Used During the SEE Testing of the CDCLVP111-SEP shows the connections, limits, and compliance values used during the testing. Figure 6-1 shows a block diagram of the setup used for SEE testing of the CDCLVP111-SEP.

All boards used for SEE testing were fully checked for functionality. Dry runs were also performed to verify that the test system was stable under all bias and load conditions prior to being taken to the test facility. During the heavy-ion testing, the LabVIEW control program powered up the CDCLVP111-SEP device and set the external sourcing and monitoring functions of the external equipment. After functionality and stability was confirmed, the beam shutter was opened to expose the device to the heavy-ion beam. The shutter remained open until the target fluence was achieved (determined by external detectors and counters). During irradiation, the NI scope cards continuously monitored the signals. When the output exceeded the pre-defined trigger, a data capture was initiated. No sudden increases in current were observed (outside of normal fluctuations) on any of the test runs and indicated that no SEL.

Figure 6-1 Block Diagram of the SEE Test Setup for the CDCLVP111-SEP