ZHCSTB3A October 2023 – October 2023 TSM24B
PRODUCTION DATA
- 1
- 1特性
- 2應(yīng)用
- 3說明
- 4Revision History
- 5Pin Configuration and Functions
- 6Specifications
- 7Application and Implementation
- 8Device and Documentation Support
- 9Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DBZ|3
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
5 Pin Configuration and Functions
Figure 5-1 DBZ Package, 3-Pin SOT-23 (Top View)Table 5-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| IO | 3 | I/O | Surge and ESD protected IO |
| GND | 1, 2 | G | Connect to ground. To achieve the rated performance, connect pin 1 and 2 together on the PCB as close to the device as possible. |
(1) I = Input, O = Output, I/O = Input or Output, G
= Ground