ZHCSTB3A October 2023 – October 2023 TSM24B
PRODUCTION DATA
| THERMAL METRIC(1) | TSM24B | UNIT | |
|---|---|---|---|
| DBZ (SOT-23) | |||
| 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 220.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 122.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 54.1 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 16.6 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 53.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |