ZHCS141E August 2011 – Oct 2019 TS3DS10224
PRODUCTION DATA.
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
TI recommends that the digital control pins SAI, SBI, SAO, and SBO be pulled up to VCC or down to GND to avoid undesired switch positions that could result from a floating pin. Unused pins for the signal paths INA, INB, OUTAx, and OUTBx must be terminated with a 50-Ω resistor to ground to reduce signal reflections in high-speed applications.
The thermal pad may be left floating or connected to ground.